At a glance
Specifications
Manufacturer-described platform characteristics. Verify the installed configuration and condition of any proposed system.
- Manufacturer
- Applied Materials
- Process
- Silicon, metal and dielectric etch
- Platform architecture
- Single-wafer, multi-chamber; up to four process chambers
- Wafer formats across the family
- 150mm, 200mm and 300mm, depending on mainframe and chambers
- Named configurations
- DPS DTM, DPS Plus and Centura AP
Applications
The manufacturer describes deep reactive ion etch for DPS DTM and metal etch for DPS Plus. Centura AP chamber technologies cover poly, metal, oxide and deep reactive ion etch applications.
Configuration and compatibility
Specify the desired chamber technology as well as the Centura name. Wafer size and material compatibility must be confirmed for the proposed system.
Useful supporting records include the configuration sheet, module identifiers, wafer-handling details, included peripherals and available service history. Ask for documentation specific to the system being discussed.
What to check before buying or selling
- Identify the exact material stack, feature requirements and intended wafer size.
- Ask for chamber identifiers, installed RF hardware, endpoint configuration and wafer-handling details.
- Request available maintenance, contamination-history and process-qualification documentation.
- Confirm which peripherals and software are included, and define the installation and acceptance scope.
Footprint, utility requirements, software, throughput, process performance, price and lead time depend on the exact system and project scope. Request the relevant site-planning and configuration documents when evaluating an offer.
Equipment handling and project planning
Discuss inspection, deinstallation, packing, transport and installation as part of the project scope. Identify the delivery destination, access constraints, included peripherals and the teams responsible for each handover.
Equipment-specific procedures and site requirements should come from the applicable manufacturer documentation and qualified personnel. Lync Semi can discuss logistics, technical advisory and services for select platforms.
Common questions
Are all Centura Etch systems interchangeable?
No. Compare the actual mainframe, chamber configuration, wafer-handling setup and documentation against your process requirements before evaluating a proposed system.
What should accompany a request for Centura pricing?
Include the target application, wafer size, required chamber configuration, destination and project timing. If selling a system, attach its configuration and available condition documentation.
Source documents
Platform facts are summarized from the manufacturer reference below. The checklist and project questions are Lync Semi guidance for evaluating a particular system.
Applied Materials — Centura EtchManufacturer product and platform names belong to their respective owners. This independent guide does not imply manufacturer authorization or certification.
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