Applied Materials · PVD · Platform guide

Applied Materials Endura PVD

The Endura family deposits metal films for semiconductor interconnects and packaging. Its modular vacuum platform combines deposition and preclean steps; the installed chamber configuration determines the process capability.

At a glance

Specifications

Manufacturer-described platform characteristics. Verify the installed configuration and condition of any proposed system.

Manufacturer
Applied Materials
Process
Physical vapor deposition (PVD)
Platform architecture
Up to nine process chambers, including two preclean chambers
Legacy wafer formats discussed by the manufacturer
150mm and 200mm; confirm the exact system configuration
Representative applications
Aluminum and copper interconnects; underbump metallization

Applications

Endura applications span front-end metallization, interconnects and packaging. The manufacturer also discusses power, MEMS, RF and photonics applications. A process requirement should be matched to the particular chamber set.

Configuration and compatibility

Record the mainframe generation, chamber identities and installed wafer-handling hardware. A family name alone does not identify the film stack a particular system can run.

Useful supporting records include the configuration sheet, module identifiers, wafer-handling details, included peripherals and available service history. Ask for documentation specific to the system being discussed.

What to check before buying or selling

  1. Provide the target wafer diameter, substrate, film stack and deposition requirements.
  2. Request a chamber-by-chamber configuration list and the associated maintenance records.
  3. Ask which pumps, power supplies, chillers, controllers and other peripherals are included.
  4. Define the inspection and acceptance evidence needed before agreeing a purchase.

Footprint, utility requirements, software, throughput, process performance, price and lead time depend on the exact system and project scope. Request the relevant site-planning and configuration documents when evaluating an offer.

Equipment handling and project planning

Discuss inspection, deinstallation, packing, transport and installation as part of the project scope. Identify the delivery destination, access constraints, included peripherals and the teams responsible for each handover.

Equipment-specific procedures and site requirements should come from the applicable manufacturer documentation and qualified personnel. Lync Semi can discuss logistics, technical advisory and services for select platforms.

Common questions

How do I request the right Endura configuration?

Send the wafer size, required films, preferred chamber configuration, destination and project timing with your pricing request. Attach a configuration sheet if you have one.

Does this guide show an available Endura unit?

This is a platform reference. Use the pricing request to discuss sourcing options and confirm current availability, exact configuration and commercial terms with Lync Semi.

Source documents

Platform facts are summarized from the manufacturer reference below. The checklist and project questions are Lync Semi guidance for evaluating a particular system.

Applied Materials — Endura PVD

Manufacturer product and platform names belong to their respective owners. This independent guide does not imply manufacturer authorization or certification.

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