Lapping, Polishing, GrindingDisco
Disco DFG850 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DFG850 guide →Lapping, Polishing, GrindingDisco
Disco DFG860 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DFG860 guide →Wafer SingulationDisco
Disco DFL 7020 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFL 7020 guide →Wafer SingulationDisco
Disco DFL 7160 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFL 7160 guide →Wafer SingulationDisco
Disco DFL 7161 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFL 7161 guide →Wafer SingulationDisco
Disco DFL 7340 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFL 7340 guide →Wafer SingulationDisco
Disco DFL 7341 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFL 7341 guide →Wafer SingulationDisco
Disco DFL 7361 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFL 7361 guide →Wafer SingulationDisco
Disco DFL 7362 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DFL 7362 guide →Lapping, Polishing, GrindingDisco
Disco DFP 8140 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFP 8140 guide →Lapping, Polishing, GrindingDisco
Disco DFS8910 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DFS8910 guide →Lapping, Polishing, GrindingDisco
Disco DFS8960 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the DFS8960 guide →Wafer SingulationDisco
Disco DFU2CR-E has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DFU2CR-E guide →Lapping, Polishing, GrindingDisco
Disco DGP8760 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 200mm, 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the DGP8760 guide →Wafer SingulationDisco
Disco DGP8760+DFM2700 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DGP8760+DFM2700 guide →Wafer SingulationDisco
Disco DGP8761 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm, 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DGP8761 guide →Wafer SingulationDisco
Disco DGP8761+DFM2800 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DGP8761+DFM2800 guide →Lapping, Polishing, GrindingDisco
Disco DGP8762/DFM9200 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DGP8762/DFM9200 guide →Support EquipmentDisco
Disco Parts has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the Disco Parts guide →Wafer BonderDisco
Disco DSL7361 has a recorded process classification of Wafer Bonder in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the DSL7361 guide →PCB / SMTDisco
Disco DSM080 has a recorded process classification of PCB / SMT in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DSM080 guide →Lapping, Polishing, GrindingDisco
Disco DTG 8460 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the DTG 8460 guide →Lapping, Polishing, GrindingDisco
Disco DTG8440 has a recorded process classification of Lapping, Polishing, Grinding in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DTG8440 guide →Support EquipmentDisco
Disco DTU 1531 has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DTU 1531 guide →Support EquipmentDisco
Disco DTU 1550 has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DTU 1550 guide →Support EquipmentDisco
Disco DTU-152 has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DTU-152 guide →Support EquipmentDisco
Disco DTU162 has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DTU162 guide →Support EquipmentDisco
Disco DTU170 has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DTU170 guide →Support EquipmentDisco
Disco DVC010 has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DVC010 guide →Wafer SingulationDisco
Disco EAD 6340K has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the EAD 6340K guide →Wafer SingulationDisco
Disco EAD-6340 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the EAD-6340 guide →Wafer SingulationDisco
Disco EAD-6450 has a recorded process classification of Wafer Singulation in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the EAD-6450 guide →Lab EquipmentDiscovery
Discovery DSC-R405 has a recorded process classification of Lab Equipment in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DSC-R405 guide →PCB / SMTDKSH
DKSH NTM 0511-M-1000-2 has a recorded process classification of PCB / SMT in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the NTM 0511-M-1000-2 guide →PCB / SMTDKSH
DKSH NTM 0710LM has a recorded process classification of PCB / SMT in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the NTM 0710LM guide →PCB / SMTDKSH
DKSH NTM 2510-M-1000-2 has a recorded process classification of PCB / SMT in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the NTM 2510-M-1000-2 guide →PhotolithographyDMS
DMS Reticle Stocker has a recorded process classification of Photolithography in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the Reticle Stocker guide →Support EquipmentDNS
(DNS Parts) has a recorded process classification of Support Equipment in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the (DNS Parts) guide →Wet Processing / Wafer CleaningDNS
DNS AS-2000 has a recorded process classification of Wet Processing / Wafer Cleaning in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm, 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the AS-2000 guide →MetrologyDNS
DNS CV-8000 has a recorded process classification of Metrology in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm. Confirm the classification, configuration and condition against the system documentation.
Read the CV-8000 guide →PhotolithographyDNS
DNS 60A has a recorded process classification of Photolithography in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm. Confirm the classification, configuration and condition against the system documentation.
Read the DNS 60A guide →PhotolithographyDNS
DNS 60B has a recorded process classification of Photolithography in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm. Confirm the classification, configuration and condition against the system documentation.
Read the DNS 60B guide →Wet Processing / Wafer CleaningDNS
DNS 629 has a recorded process classification of Wet Processing / Wafer Cleaning in Lync Semi's inventory knowledge snapshot. Confirm the classification, configuration and condition against the system documentation.
Read the DNS 629 guide →PhotolithographyDNS
DNS 80A has a recorded process classification of Photolithography in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm, 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DNS 80A guide →Wet Processing / Wafer CleaningDNS
DNS-80B has a recorded process classification of Wet Processing / Wafer Cleaning in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm, 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the DNS-80B guide →Wet Processing / Wafer CleaningDNS
DNS DW-629-BV(P) has a recorded process classification of Wet Processing / Wafer Cleaning in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 150mm. Confirm the classification, configuration and condition against the system documentation.
Read the DW-629-BV(P) guide →Etch / AsherDNS
DNS FC-3000 has a recorded process classification of Etch / Asher in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 300mm. Confirm the classification, configuration and condition against the system documentation.
Read the FC-3000 guide →Wet Processing / Wafer CleaningDNS
DNS FC-821L has a recorded process classification of Wet Processing / Wafer Cleaning in Lync Semi's inventory knowledge snapshot. Recorded wafer formats: 200mm. Confirm the classification, configuration and condition against the system documentation.
Read the FC-821L guide →